Failure Analysis

The failure analysis investigates the failure or damage of a product. Since the root cause of electrical overstress is always located outside the damaged product, the root cause of electrical overstress cannot be determined by failure analysis. Failure analysis can only determine the root causes of device weaknesses. Consequently, as electrical overstress is concerned, the failure analysis is limited to:

  1. the identification of the failure location
  2. the identification of the failure signature